- Product Model HSB22-606010
- Brand CUI Devices
- RoHS Yes
- Description HEAT SINK, BGA, 60 X 60 X 10 MM
- Categories Радиаторы
-
PDF
- In Stock 1500
Technical Details
- Material Aluminum
- Length 2.362" (60.00mm)
- Shape Square, Pin Fins
- Type Top Mount
- Width 2.362" (60.00mm)
- Package Cooled BGA
- Attachment Method Adhesive
- Power Dissipation @ Temperature Rise 9.8W @ 75°C
- Thermal Resistance @ Forced Air Flow 2.60°C/W @ 200 LFM
- Thermal Resistance @ Natural 7.62°C/W
- Fin Height 0.394" (10.00mm)
- Material Finish Black Anodized
- ECCN EAR99
- HTSUS 8473.30.5100
- Moisture Sensitivity Level (MSL) Not Applicable
- REACH Status REACH Unaffected
- RoHS Status ROHS3 Compliant
Related Products
HEATSINK 70X70X25MM XCUT CP
In Stock: 1841
HEAT SINK, BGA, 40 X 40 X 10 MM
In Stock: 2347
HEAT SINK, BGA, 40 X 40 X 25 MM
In Stock: 1689
HEAT SINK, BGA, 45 X 45 X 15 MM
In Stock: 2434
HEAT SINK, BGA, 43.1 X 43.1 X 16
In Stock: 2445
HEAT SINK, BGA, 60 X 60 X 22 MM,
In Stock: 1500
