- Product Model HSB26-343408
- Brand CUI Devices
- RoHS Yes
- Description HEAT SINK, BGA, 33.5 X 33.5 X 8
- Categories Радиаторы
-
PDF
- In Stock 2281
Technical Details
- Material Aluminum Alloy
- Length 1.319" (33.50mm)
- Shape Square, Pin Fins
- Type Top Mount
- Width 1.319" (33.50mm)
- Package Cooled BGA
- Attachment Method Adhesive
- Power Dissipation @ Temperature Rise 4.94W @ 75°C
- Thermal Resistance @ Forced Air Flow 5.30°C/W @ 200 LFM
- Thermal Resistance @ Natural 15.19°C/W
- Fin Height 0.315" (8.00mm)
- Material Finish Black Anodized
- ECCN EAR99
- HTSUS 8473.30.5100
- Moisture Sensitivity Level (MSL) Not Applicable
- REACH Status REACH Unaffected
- RoHS Status ROHS3 Compliant
Related Products
HEATSINK TO-220 2.5W LOW PROFILE
In Stock: 10112
HEATSINK CPU W/ADHESIVE 1.51"SQ
In Stock: 1500
HEAT SINK, BGA, 25 X 25 X 18 MM
In Stock: 4414
HEAT SINK, BGA, 40 X 40 X 10 MM
In Stock: 2347
HEAT SINK, BGA, 40 X 40 X 18 MM
In Stock: 2658
HEAT SINK, BGA,25 X 25 X 10 MM
In Stock: 2359
HEAT SINK, BGA, 28.5 X 28.5 X 10
In Stock: 2544
HEAT SINK, EXTRUSION, TO-220, 25
In Stock: 15788
CERAMIC HEAT SINK - WAVE TYPE
In Stock: 2900
HEATSINK CPU XCUT
In Stock: 6262
