Technical Details

• Material Aluminum
• Length 1.063" (27.00mm)
• Shape Square, Pin Fins
• Type Board Level
• Width 1.063" (27.00mm)
• Package Cooled BGA, FPGA
• Attachment Method Thermal Tape, Adhesive (Included)
• Power Dissipation @ Temperature Rise 3.0W @ 90°C
• Thermal Resistance @ Forced Air Flow 9.30°C/W @ 200 LFM
• Thermal Resistance @ Natural 30.60°C/W
• Fin Height 0.394" (10.00mm)
• Material Finish Black Anodized
• ECCN EAR99
• HTSUS 8473.30.5100
• Moisture Sensitivity Level (MSL) Not Applicable
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant